Precision Circuit Lab
Multi-stage facility equipped with plasma injection for high-temperature bonding and distributed heat sinks to manage thermal loads across parallel assembly zones. Processes ore into finished boards with tighter tolerances.
Stats
| Level | 2 |
| Build Cost | 401,000 cr |
| Build Time | 200s |
| Labor | 18 |
| Power Draw | 2 |
| Life Support Draw | 1 |
Upgrade Path
Recipe
| Output | Fabricate Circuit Boards |
| Crafting Time | 6s |
Recipe Inputs
| Item | Quantity |
|---|---|
| Copper Ore | 3 |
| Energy Crystal | 1 |
| Silicon Ore | 2 |
Recipe Outputs
| Item | Quantity |
|---|---|
| Circuit Board | 2 |
Build Materials
| Material | Quantity |
|---|---|
| Steel Plate | 1150 |
| Copper Piping | 550 |
| Structural Frame | 400 |
| Control Node | 150 |
| Heat Sink | 450 |
| Plasma Injector | 150 |
Construction
| Base Material | Quantity |
|---|---|
| Aluminum Ore | 9950 |
| Copper Ore | 8250 |
| Fluorine Gas | 150 |
| Gold Ore | 300 |
| Iridium Ore | 150 |
| Iron Ore | 8500 |
| Nickel Ore | 800 |
| Palladium Ore | 300 |
| Plasma Residue | 300 |
| Silicon Ore | 2350 |
| Silver Ore | 1500 |
| Titanium Ore | 750 |
| Tungsten Ore | 5450 |
View JSON Data
[{"item_id":"aluminum_ore","quantity":9950},{"item_id":"copper_ore","quantity":8250},{"item_id":"fluorine_gas","quantity":150},{"item_id":"gold_ore","quantity":300},{"item_id":"iridium_ore","quantity":150},{"item_id":"iron_ore","quantity":8500},{"item_id":"nickel_ore","quantity":800},{"item_id":"palladium_ore","quantity":300},{"item_id":"plasma_residue","quantity":300},{"item_id":"silicon_ore","quantity":2350},{"item_id":"silver_ore","quantity":1500},{"item_id":"titanium_ore","quantity":750},{"item_id":"tungsten_ore","quantity":5450}]